HYTE X50 Air Dual Chamber Mid Tower Mesh Case > Snow White

Total Defiance There’s a playful boldness to the HYTE X50 Air at first glance—its rounded edges, the lifted stance, the continuous curves—but beneath that friendly silhouette sits a serious dual-chamber layout built for oversized hardware. The signature hinged side panel still defines the case, only here it’s replaced with a full perforated surface that trades glass for unrestricted airflow. Light from your build filters naturally through the perforations, giving your components a soft glow while the chassis keeps temperatures under control. The whole design feels playful at first, but the engineering is confidently thought through. Micro-Mesh Front Intake A full micro-mesh front surface feeds cool air straight into the chamber with low restriction. The uniform pattern keeps noise controlled while delivering a steady column of fresh intake for front-mounted fans and radiators. Louvered Blade Venting The patent-pending louver system guides warm air out with assertive directionality. Each angled blade disrupts heat buildup and maintains airflow momentum, while the metal structure adds stiffness to the surrounding panels. Cold-Floor Airflow Path The bottom chamber accepts up to three 120 mm fans—even thicker models—creating a direct stream of cool air aimed at the graphics card. Long, triple-slot GPUs stay at comfortable temperatures thanks to this focused lower intake. Structural PSU Canopy The power supply sits beneath a rigid shroud that doubles as a routing corridor. Tie-downs are aligned for clean cable paths, and HYTE includes Velcro straps inside and outside the compartment so builders can keep lines tight and disciplined. Expanding on Expansion Slots Even the expansion slots break from convention. Instead of rigid plates, the rear panel uses open structural bars that look almost otherworldly, and they serve a real purpose: letting hot air escape freely so the exhaust fan doesn’t have to fight against unnecessary resistance. Hardware Headroom The X50 Air accommodates E-ATX motherboards up to 10.6 inches wide, GPUs up to 430 mm long and 160 mm tall, and CPU coolers up to 170 mm—ample space for top-tier components. Power supplies up to 223 mm slot in with room to spare beneath the canopy. cTwo 2.5-inch drive placements and a 3.5-inch bay cover the essentials for SSD-heavy builds. Seven full-size horizontal expansion slots support multi-card layouts and oversized GPUs without congestion. A mechanical power switch anchors the front I/O with a satisfying click, complemented by a 3.5 mm audio combo jack, two USB 3.2 Gen 1 Type-A ports, and a USB 3.2 Gen 2×2 Type-C port for high-speed external devices.       Specifications: Form Factor ATX Mid-Tower Volume 63L Case Dimensions 485mm (H) x 510mm (L) x 255mm (W) Chassis Material(s) 1mm Thick Steel, ABS Motherboard Support E-ATX (up to 10.6”), ATX, MATX, ITX Power Supply Up to 223mm GPU Support Up to 430mm Length, 160mm Height Side Fan Support 3x 120mm Front Fan Support 3x 120mm / 140mm Bottom Fan Support 3x 120mm up to 32mm Thick Rear Fan Support 1x 120mm Side Radiator Support Up to 360mm Long & 70mm Thick Front Radiator Support Up to 360mm Long & 105mm Thick Rear Radiator Support 120mm Max CPU Cooler Height 170mm Storage Support 2x 2.5” Drives, 1x 3.5” Drive Expansion Slots 7 Horizontal (Full-Size) Front I/O (Audio) 3.5mm Combo Jack Front I/O (USB) 1x USB 3.2 Gen 2×2 Type-C, 2x USB 3.2 Gen 1×1 Type-A Front I/O (Power) Tactile Mechanical Power Switch with LED Dust Filters Bottom, Magnetic Feet Contemporary